JILIN SINO-MICROELECTRONICS CO.,LTD
>>Location:Home Page-Milestones

About us

Milestones

    2021

  • SCR products for White Good was released in 12 Jul.2021

  • TVS-ZENER was released as protecting device in 5Jun.2021

  • The 2020 annual shareholder’s of JSMC was held in 20 May.2020

  • There were more than 1700 staffs organized to complete vaccination of COVID-19 vaccine in May.2021

  • CCT MOS product was released in 30 Apr.2021

  • Experimental center passed CNAS re-evaluation in Apr. 2021

  • High-frequency IGBT Product in U-series was released in 1 Mar. 2021

  • 2020

  • The patent for invention of Semiconductor silicon-based optical waveguide device and preparation method in 15 Dec. 2020.

  • The patent for invention of ​Power semiconductor module and packaging method come out in 15 Dec. 2020.

  • The patent for invention of Field plate buried layer terminal structure in trench of semiconductor device and manufacturing method come out in 15 Dec. 2020.

  • The patent for invention of Method for expanding film and taking particles of wafer and method for producing wafer come out in 10 Nov. 2020.

  • The patent for invention of Modification method of homogenizing machine come out in 3 Nov. 2020.

  • The patent for invention of one kind of IGBT device and the manufacturing method come out in 8 Sep. 2020.

  • The patent for invention of Method for improving alignment accuracy of photoetching marks, preparation method of super junction product and super junction product come out in 8 Sep. 2020.

  • The patent for invention of Processing method and application of semiconductor wafer and preparation method of Schottky diode come out in 7 Jul. 2020.

  • The patent for invention of chip to be pasted and processing technology​ come out in 7 Jul. 2020.

  • 2018

  • "Wafer preparation method for improving wafer strength and adhesion strength between back metal and silicon" was granted of Patent for Utility Model by National Intellectual Property Administration in 2 Aug. Application Date - 31 Aug. 2016 Patent No. - 201610795538.5

  • "Suppressor electrode and ion implanter" was granted of Patent for Utility Model by National Intellectual Property Administration in 30 Mar. Application Date - 26 Sep. 2017 Patent No. - 2017212359442

  • 2017

  • "IGBT device" was granted of Patent for Utility Model by National Intellectual Property Administration in 28 Dec. Patent No. - 201620786778.4

  • "MOSFET device" was granted of Patent for Utility Model by National Intellectual Property Administration in 2 Aug. Patent No. - 201620786862.6

  • 2016

  • "IGBT device" was granted of Patent for Utility Model by National Intellectual Property Administration in 28 Dec. Patent No. - 201620786864.5

  • "MOSFET device" was granted of Patent for Utility Model in 28 Dec. Patent No. - 201620786973.7

  • "Method to improve the consistency of the first and last chip parameters of the diffusion furnace" was granted of Patent for Utility Model by National Intellectual Property Administration in 30 Nov. Patent No. - 201410468782.1

  • "Semiconductor spin dryer controller" was granted of Patent for Utility Model by National Intellectual Property Administration in 23 Nov. Patent No. - 201410468782.1

  • We established cooperative relationship with Alibaba international station in Sep.

  • "A removal tool for polishing cloth special for CMP technology" was granted of Patent for Utility Model by National Intellectual Property Administration in 31 Aug. Patent No. - 201620226830.0

  • Officialy pushed out the Enterprise Spirit of "Agility Tenacity Celerity Teamwork" and Acting standard of " Sincere and harmonious; concise and efficient" in 30 Sep. 2016.

  • Offcial Mall of JSMC started to open for trial service in 5 Aug. 2016.

  • 2015

  • 6-inch products went into operation in 23 Nov. 2015.

  • 2014

  • The intelligent power module (IPM) production line went into operation.

  • 2013

  • 2013年2月13日公司自主研发的“触发电流对称的双向晶闸管”被国家知识产权局授予实用新型专利权,申请日为:2012年6月11日,专利号为:201220300404.9。

  • 2013年1月9日公司自主研发的“硅片正反两面各压一条线的JFET二极管”被国家知识产权局授予实用新型专利权,申请日为:2012年6月11日,专利号为: 201220271997.0。

  • 2010

  • "Asymmetrical chamfered single chip" was granted of Patent for Utility Model by National Intellectual Property Administration in 12 Feb. Application Date - 7 Jul. 2009 Patent No. - 200920093957.X

  • "Full encapsulation mold of semiconductor device with retractable positioning pin under plastic molding compound extrusion" was granted of Patent for Utility Model by National Intellectual Property Administration in 29 Jan. Application Date - 20 Aug. 2009 Patent No. - 200920094211.0

  • 2009

  • Developing MOSFET products cooperation with Vishay.

  • 2008

  • Set up a 6-inch new power semiconductor device production line.

  • 2004

  • Established Jilin Magic Semiconductor Co.,Ltd with Fairchild in Sep.

  • 2003

  • Signed up a joint venture with Philps in Beijing in 25 Nov. 2003.

  • 2001

  • Jilin Sino-Electronics Co.,Ltd was offcially listed in Shanghai Stock Exchange in 16 Mar. 2001.

  • 2000

  • The designation was changed to Sino-Microelectronics Co.,Lted in 16 May 2000.

  • 1998

  • Jilin Huaxing Electronic Group Co.,Ltd was established in 25 May 1998.

  • 1984

  • 3DD15、DD01、DDOS and other high power transistors were rewarded to Jilin Provincial Quality Product.

  • 1983

  • Bring in equipment to transform the technique and transfer the location to No.100 Changjiang Street

  • 1982

  • Signed up with WING KWONG Electronic Co. from Hong Kong to bringed in equipment for TO-220 Plastic Tube and completed adjustment;

  • 1970

  • 3DA4S22、2CW、2CG and other products were designed from 1970-1974.

  • 1969

  • The designation of factory was changed to Jilin Semiconductor Factory in Feb. 1969.

  • 3 production lines:Alloy method low-frequency high-power transistor production line、Planar low-frequency high-power transistor production line、Low frequency and low power transistor production line. 3DD130W、3DD150W、3DD250W transistor was produced initially

  • 1965

  • Jilin Semiconductor Device Factory was founded in Sep. and firstling was published in Dec.

Friend links: 中华人民共和国工业和信息化部 中国证券监督管理委员会 上海证券交易所 中国半导体行业协会 吉林麦吉柯半导体有限公司 吉林华微斯帕克电气有限公司
Copyright©SINO-MICROELECTRONICS 吉公网安备 22029002000108号 吉ICP备05007102号 designed by:baihang